经典案例
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LB Design Case
ATE:PS1600
IC Type：AI
Package：21*21mm FCBGA 2453
Max current：35A@0.75V
Ball Pitch: 0.4mm
Multi sites: 2
Interface：4 Channel 32 bit LPDDR4 4266Mbps
PCIE 3.0 8GT/s
RGMII
USB 3.0
PCB Layers：50
PCB Size: 291*430mm
BB Via Type: 4
ATE: ultraflex
IC Type：10通道ADC
Package：FCBGA 361
Sites: 1
PCB Layers：36
PCB Size: 403*403mm
Probe card design case
ATE: PS1600
IC Type：ASIC
Bump pitch：60um
Pin count：16,832
Max current：15A*8@0.35V
Multi sites: 16
PCB Layers：48
PCB Size: 582*430mm
Needle type：cobra
Probe diameter: 2mil
High C.C.C: 1A
Life Time： 80-100W TD
ATE:PS1600
IC Type：ASIC
Bump pitch：130um
Pin count：35,352
Max current：30A@0.75V
Interface：8x16 lane
8Gbps per Serdes
PCB Layers：40
Needle type：cobra
Probe diameter: 3mil
High C.C.C: 1A
Life Time：80-100W TD